公开(公告)号：US20220199563A1

公开(公告)日：2022-06-23

申请号：US17553540

申请日：2021-12-16

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Roberto RIZZA

IPC: H01L23/00 ,  H01L23/492

Abstract: The packaged power electronic device has a bearing structure including a base section and a transverse section extending transversely to the base section. A die is bonded to the base section of the bearing structure and has a first terminal on a first main face and a second and a third terminal on a second main face. A package of insulating material embeds the semiconductor die, the second terminal, the third terminal and at least partially the carrying base. A first, a second and a third outer connection region are electrically coupled to the first, the second and the third terminals of the die, respectively, are laterally surrounded by the package and face the second main surface of the package. The transverse section of the bearing structure extends from the base section towards the second main surface of the package and has a higher height with respect to the die.