POWER MODULE FOR HALF-BRIDGE CIRCUIT WITH SCALABLE ARCHITECTURE AND IMPROVED LAYOUT

    公开(公告)号:US20230420341A1

    公开(公告)日:2023-12-28

    申请号:US18331837

    申请日:2023-06-08

    Inventor: Sergio SAVINO

    CPC classification number: H01L23/49562 H01L23/3107 H02M7/003

    Abstract: A power module includes a support, a first control contact area on the support, a second control contact area on the support, a first electronic power device, a second electronic power device, a first clip, a second clip, a third clip, and a package embedding the support, the first and the second electronic power devices as well as partially the first, the second and the third clips. The first electronic power device has a first conduction pad electrically coupled to the first clip, a second conduction pad electrically coupled to the third clip, and a control pad coupled to the first control contact area. The second electronic power device has a first conduction pad electrically coupled to the third clip, a second conduction pad electrically coupled to the second clip, and a control pad coupled to the second control contact area.

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