公开(公告)号：US11916090B2

公开(公告)日：2024-02-27

申请号：US17342765

申请日：2021-06-09

Applicant: STMicroelectronics, Inc.

Inventor： Aaron Cadag ,  Rohn Kenneth Serapio ,  Ela Mia Cadag

IPC: H01L31/0203 ,  H01L27/146 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/49503 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16258 ,  H01L2224/8184

Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.