公开(公告)号：US20240162186A1

公开(公告)日：2024-05-16

申请号：US18389020

申请日：2023-11-13

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sandrine LHOSTIS ,  Emilie DELOFFRE ,  Sebastien MERMOZ

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/89 ,  H01L23/49827 ,  H01L24/27 ,  H01L23/49861 ,  H01L2224/27522 ,  H01L2224/80357 ,  H01L2224/80895 ,  H01L2924/1431

Abstract: A first wafer includes a first semiconductor layer and first metal contacts on a side of a first surface of the first semiconductor layer. A second wafer includes a second semiconductor layer and second metal contacts on a side of a first surface of the second semiconductor layer. A handle is bonded onto a surface of the second wafer opposite to the second semiconductor layer. The second semiconductor layer is then removed to expose the second metal contacts. A bonding is then performed between the first and second wafers to electrically connect the first metal contacts to the second metal contacts.