公开(公告)号：US20150200151A1

公开(公告)日：2015-07-16

申请号：US14590404

申请日：2015-01-06

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Sandrine LHOSTIS ,  Olga Kokshagina ,  Yann Beilliard ,  Vincent Fiori

IPC: H01L23/473 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/473 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.

Abstract translation: 一种装置包括支撑件，支撑件上方的三维集成结构以及围绕结构设置的侧向封装区域。 横向封装区域包括被配置为使得循环冷却流体成为可能的第一通道。

公开(公告)号：US20240162186A1

公开(公告)日：2024-05-16

申请号：US18389020

申请日：2023-11-13

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sandrine LHOSTIS ,  Emilie DELOFFRE ,  Sebastien MERMOZ

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/89 ,  H01L23/49827 ,  H01L24/27 ,  H01L23/49861 ,  H01L2224/27522 ,  H01L2224/80357 ,  H01L2224/80895 ,  H01L2924/1431

Abstract: A first wafer includes a first semiconductor layer and first metal contacts on a side of a first surface of the first semiconductor layer. A second wafer includes a second semiconductor layer and second metal contacts on a side of a first surface of the second semiconductor layer. A handle is bonded onto a surface of the second wafer opposite to the second semiconductor layer. The second semiconductor layer is then removed to expose the second metal contacts. A bonding is then performed between the first and second wafers to electrically connect the first metal contacts to the second metal contacts.