METHOD FOR POWERING A MODULE INCORPORATED WITHIN A SYSTEM-ON-A-CHIP AND CORRESPONDING ELECTRONIC DEVICE
    7.
    发明申请
    METHOD FOR POWERING A MODULE INCORPORATED WITHIN A SYSTEM-ON-A-CHIP AND CORRESPONDING ELECTRONIC DEVICE 有权
    用于在系统中的芯片和相应的电子设备中引入模块的方法

    公开(公告)号:US20160327970A1

    公开(公告)日:2016-11-10

    申请号:US14958583

    申请日:2015-12-03

    Inventor: Christophe Belet

    CPC classification number: G05F1/46 G06F1/26

    Abstract: A module incorporated within a system-on-a-chip operating in a steady-state power supply phase is powered by supplying to the module a regulated power supply voltage obtained from a feedback control loop. The receives a main power supply voltage and a negative feedback voltage. The negative feedback voltage is generated inside the system-on-a-chip starting from an effective supply voltage of the module and from a setpoint signal corresponding to a desired regulated power supply voltage.

    Abstract translation: 通过向模块提供在反馈控制回路中获得的稳定的电源电压,将并入在稳态电源阶段中的片上系统中的模块供电。 接收主电源电压和负反馈电压。 从模块的有效电源电压和对应于期望的稳压电源电压的设定点信号开始,在片上系统内产生负反馈电压。

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