THERMAL DISSIPATION
    1.
    发明公开
    THERMAL DISSIPATION 审中-公开

    公开(公告)号:US20230171927A1

    公开(公告)日:2023-06-01

    申请号:US17989173

    申请日:2022-11-17

    CPC classification number: H05K7/2039

    Abstract: A heat dissipation device includes a substrate with a network of thermally-conductive vias and thermally-conductive layers. The substrate has a first surface and a second surface opposite to the first surface. A heat dissipation interface layer including a stack of a first layer made of a first thermally-conductive material and a second layer made of a second thermally-conductive material. The first material is different from the second material. A surface of the first layer is coplanar with the first surface of the substrate. At least one of the thermally-conductive vias of said network supports and is in contact with the first layer. At least one opening thoroughly crosses the stack of the first and second layers. Material of the substrate fills the opening in the first layer.

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