公开(公告)号：US20230171927A1

公开(公告)日：2023-06-01

申请号：US17989173

申请日：2022-11-17

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Richard REMBERT ,  Fanny LAPORTE ,  Catherine CADIEUX

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: A heat dissipation device includes a substrate with a network of thermally-conductive vias and thermally-conductive layers. The substrate has a first surface and a second surface opposite to the first surface. A heat dissipation interface layer including a stack of a first layer made of a first thermally-conductive material and a second layer made of a second thermally-conductive material. The first material is different from the second material. A surface of the first layer is coplanar with the first surface of the substrate. At least one of the thermally-conductive vias of said network supports and is in contact with the first layer. At least one opening thoroughly crosses the stack of the first and second layers. Material of the substrate fills the opening in the first layer.

公开(公告)号：US20210391227A1

公开(公告)日：2021-12-16

申请号：US17345600

申请日：2021-06-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Richard REMBERT ,  Didier SIGNORET ,  Olivier FRANIATTE

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic device includes a support substrate. A face is covered with a soldermask layer. At least part of the soldermask layer includes roughnesses providing a rough grip surface. An electronic die is mounted on the support substrate. A molding resin encapsulates the electronic die and partially or completely covers the soldermask layer.