公开(公告)号：US20210391227A1

公开(公告)日：2021-12-16

申请号：US17345600

申请日：2021-06-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Richard REMBERT ,  Didier SIGNORET ,  Olivier FRANIATTE

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic device includes a support substrate. A face is covered with a soldermask layer. At least part of the soldermask layer includes roughnesses providing a rough grip surface. An electronic die is mounted on the support substrate. A molding resin encapsulates the electronic die and partially or completely covers the soldermask layer.