公开(公告)号：US20200033537A1

公开(公告)日：2020-01-30

申请号：US16519753

申请日：2019-07-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Florian PERMINJAT ,  Jean-Michel RIVIERE

IPC: G02B6/30

Abstract: An electronic chip includes an integrated optical-wave guide having an end section that extends parallel to a face of the electronic chip. A local groove provided in the electronic chip extends adjacent to the end section of the integrated optical-wave guide. An elongate optical cable includes an optical-wave guide and has an end portion that is at least partially engaged in the local groove. The end portion of the elongate optical cable is configured to support an optical coupling of the optical-wave guide to the integrated optical-wave guide via lateral coupling in a zone of the local groove. An exterior package is provided to house the electronic chip.

公开(公告)号：US20230402745A1

公开(公告)日：2023-12-14

申请号：US18205729

申请日：2023-06-05

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Florian PERMINJAT ,  Karine SAXOD

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q21/06

CPC classification number: H01Q1/38 ,  H01Q1/364 ,  H01Q21/061

Abstract: An electronic device integrates an antenna. To fabricate such an electronic device, first antenna elements are formed on a first surface of a first substrate. The first substrate is then diced to form antenna chips. Each antenna chip includes, on a first surface corresponding to the first surface of the first substrate, one of the first antenna elements. One of the antenna chips is then bonded onto a transfer substrate. This bonding is made between a second surface of the antenna chip, orthogonal to its first surface, and an upper surface of the transfer substrate.

公开(公告)号：US20200174206A1

公开(公告)日：2020-06-04

申请号：US16701355

申请日：2019-12-03

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Florian PERMINJAT ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: G02B6/43 ,  H05K1/02

Abstract: A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.