公开(公告)号：US11437527B2

公开(公告)日：2022-09-06

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Veronique Ferre ,  Agnes Baffert ,  Jean-Michel Riviere

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/16 ,  H01L31/12 ,  H01L33/48

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.