公开(公告)号：US20170127567A1

公开(公告)日：2017-05-04

申请号：US15131652

申请日：2016-04-18

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Agnes Baffert ,  Karine Saxod

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20509 ,  H01L23/3128 ,  H01L23/4334 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a support plate with an integrated circuit chip fixed onto the support plate. A heat sink is mounted to the support plate. An electrical connection wire is provided with one end electrically connected to the heat sink and another end electrically connected to an electrical contact provided on the support plate.

公开(公告)号：US11437527B2

公开(公告)日：2022-09-06

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Veronique Ferre ,  Agnes Baffert ,  Jean-Michel Riviere

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/16 ,  H01L31/12 ,  H01L33/48

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.