公开(公告)号：US20130178017A1

公开(公告)日：2013-07-11

申请号：US13783529

申请日：2013-03-04

Applicant: STMicroelectronics (Tours) SAS

Inventor： Vincent Jarry ,  Patrick Hougron ,  Dominique Touzet ,  José Mendez

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/683 ,  H01L21/67132 ,  H01L21/78 ,  Y10T29/41 ,  Y10T83/02 ,  Y10T225/393

Abstract: A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

Abstract translation: 一种用于从半导体晶片制造半导体芯片的方法，包括以下步骤：在第一支撑框架上紧固外部尺寸小于第一框架的外部尺寸并大于第一框架的内部尺寸的第二支撑框架 ; 将晶片布置在在第二框架上延伸的膜的表面上; 通过使用能够接收第一帧的设备进行晶片处理操作; 将第二框架与第一框架分离并移除第一框架; 并通过使用能够接收第二帧的设备进行晶片处理操作。

公开(公告)号：US08772134B2

公开(公告)日：2014-07-08

申请号：US13783529

申请日：2013-03-04

Applicant: STMicroelectronics (Tours) SAS

Inventor： Vincent Jarry ,  Patrick Hougron ,  Dominique Touzet ,  José Mendez

IPC: H01L21/66 ,  B26D3/00

CPC classification number: H01L21/683 ,  H01L21/67132 ,  H01L21/78 ,  Y10T29/41 ,  Y10T83/02 ,  Y10T225/393

Abstract: A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

Abstract translation: 一种用于从半导体晶片制造半导体芯片的方法，包括以下步骤：在第一支撑框架上紧固外部尺寸小于第一框架的外部尺寸并大于第一框架的内部尺寸的第二支撑框架 ; 将晶片布置在在第二框架上延伸的膜的表面上; 通过使用能够接收第一帧的设备进行晶片处理操作; 将第二框架与第一框架分离并移除第一框架; 并通过使用能够接收第二帧的设备进行晶片处理操作。