公开(公告)号：US20240302219A1

公开(公告)日：2024-09-12

申请号：US18182058

申请日：2023-03-10

Applicant: STMicroelectronics International N.V.

Inventor： Federico VERCESI ,  Silvia NICOLI ,  Cinzia DE MARCO

IPC: G01K7/01 ,  H01L23/485 ,  H01L23/522

CPC classification number: G01K7/015 ,  H01L23/485 ,  H01L23/5226

Abstract: Disclosed herein are thermal sensor devices including TMOS devices with a mass suspended over a cavity by springs extending between a frame and the mass. The thermal sensor devices include stoppers that limit upward and/or downward movement of the springs and therefore the mass. These stoppers are formed from sidewalls supporting a top cap over the frame, springs, and mass. The stoppers are constructed by using various overlapping metal layers during fabrication. Details of forming the stoppers using these overlapping metal layers are contained here.