公开(公告)号：US20220169498A1

公开(公告)日：2022-06-02

申请号：US17534286

申请日：2021-11-23

Applicant: STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Paolo FERRARI ,  Benedetto Vigna ,  Flavio Francesco VILLA ,  Laura Maria CASTOLDI ,  Ilaria GELMI

IPC: B81B7/00

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

公开(公告)号：US20250133964A1

公开(公告)日：2025-04-24

申请号：US18915705

申请日：2024-10-15

Applicant: STMicroelectronics International N.V.

Inventor： Flavio Francesco VILLA ,  Francesco FONCELLINO ,  Marco DEL SARTO

IPC: H10N10/17 ,  H02S10/10

Abstract: A thermoelectric generator includes a thermoelectric converter and a thermal coupling structure, configured to thermally couple the thermoelectric converter to a first body at a first temperature and to a second body at a second temperature, lower than the first temperature. The thermoelectric converter includes a support body, having a structural layer and a thermal insulation layer, and a plurality of thermopiles arranged on the thermal insulation layer and thermally coupled to the thermal coupling structure. The thermal insulation layer has a thickness such as to thermally insulate the thermopiles from the structural layer and the support body is continuous and without cavities between the thermopiles and a face of the structural layer opposite to the thermopiles.