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公开(公告)号：US20220169498A1
公开(公告)日：2022-06-02
申请号：US17534286
申请日：2021-11-23
Inventor： Enri DUQI , Lorenzo BALDO , Paolo FERRARI , Benedetto Vigna , Flavio Francesco VILLA , Laura Maria CASTOLDI , Ilaria GELMI
IPC: B81B7/00
Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.
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公开(公告)号：US20240295454A1
公开(公告)日：2024-09-05
申请号：US18117070
申请日：2023-03-03
Applicant: STMicroelectronics International N.V.
Inventor： Lorenzo BALDO , Filippo DANIELE , Enri DUQI
IPC: G01L9/12
CPC classification number: G01L9/12
Abstract: A pressure-sensor includes a substrate with a cavity therein and a membrane suspended over the cavity. The cavity is connected to external air pressure so a change in external air pressure causes out-of-plane movement of the membrane. A frame suspended over the membrane includes a segment connected to the membrane but disconnected from other frame portions. A projection extends from the frame. A first spring is connected to the projection, a second spring is connected to the segment, and an end portion connects the springs so out-of-plane movement of the membrane applies out-of-plane force to the second spring, which is transferred to the first spring by the end portion and translated to an in-plane force by the first spring and applied to the projection. This causes lateral sliding movement of the frame with respect to the substrate. A capacitive-sensor detects sliding movement of the frame with respect to the substrate.
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公开(公告)号：US20240272004A1
公开(公告)日：2024-08-15
申请号：US18108154
申请日：2023-02-10
Applicant: STMicroelectronics International N.V.
Inventor： Enri DUQI , Giorgio ALLEGATO
CPC classification number: G01J5/10 , B81B7/0038 , B81B7/007 , B81C1/00285 , B81C1/00301 , B81B2201/0278 , B81B2207/012 , B81B2207/07 , B81B2207/097 , B81C2203/0109 , B81C2203/0792 , G01J2005/106
Abstract: Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.
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4.发明公开公开(公告)号：US20230280227A1
公开(公告)日：2023-09-07
申请号：US18171184
申请日：2023-02-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri DUQI , Filippo DANIELE , Lorenzo BALDO , Giulio CAPELLI , Salvatore ALONGI
CPC classification number: G01L19/04 , G01L9/0041 , G01L19/0092
Abstract: A pressure sensor device is provided with: a pressure detection structure made in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. The pressure sensor device is also provided with a heating structure, accommodated in the housing cavity and for allowing heating of the pressure detection structure from the inside of the package.
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公开(公告)号：US20230087516A1
公开(公告)日：2023-03-23
申请号：US17931482
申请日：2022-09-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Maria Eloisa CASTAGNA
Abstract: Integrated thermal sensor having a housing delimiting an internal space. A support region extends through the internal space; a plurality of thermocouple elements are carried by the support region and are electrically coupled to each other. Each thermocouple element is formed by a first and a second thermoelectrically active region of a first and, respectively, a second thermoelectrically active material, the first thermoelectrically active material having a first Seeback coefficient, the second thermoelectrically active material having a second Seeback coefficient, other than the first Seeback coefficient. At least one of the first and second thermoelectrically active regions is a silicon-based material. The first and second thermoelectrically active regions of each thermocouple element are formed by respective elongated regions extending at a mutual distance into the internal space of the housing, from and transversely to the support region.
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Patent Agency Ranking
公开(公告)号：US20210147222A1
公开(公告)日：2021-05-20
申请号：US17161367
申请日：2021-01-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Lorenzo BALDO , Domenico GIUSTI
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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公开(公告)号：US20170247249A1
公开(公告)日：2017-08-31
申请号：US15276613
申请日：2016-09-26
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI , Lorenzo BALDO , Flavio Francesco VILLA
CPC classification number: B81B7/0038 , B81B3/0086 , B81B7/0019 , B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C1/00269
Abstract: A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.
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8.发明申请公开(公告)号：US20170233245A1
公开(公告)日：2017-08-17
申请号：US15337701
申请日：2016-10-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Bruno MURARI , Sebastiano CONTI
CPC classification number: B81B7/0041 , B81B2201/0264 , G01L9/0054 , G01L9/0072 , G01L15/00 , G01L19/0645
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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公开(公告)号：US20240230596A9
公开(公告)日：2024-07-11
申请号：US18489737
申请日：2023-10-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Marco DEL SARTO , Fabio QUAGLIA , Enri DUQI
CPC classification number: G01N29/04 , G01N29/2406 , G01N29/2437 , G01N2291/0231 , G01N2291/0289 , G01N2291/106
Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.
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公开(公告)号：US20240133843A1
公开(公告)日：2024-04-25
申请号：US18489737
申请日：2023-10-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Marco DEL SARTO , Fabio QUAGLIA , Enri DUQI
CPC classification number: G01N29/04 , G01N29/2406 , G01N29/2437 , G01N2291/0231 , G01N2291/0289 , G01N2291/106
Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.
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