公开(公告)号：US10264667B2

公开(公告)日：2019-04-16

申请号：US14310601

申请日：2014-06-20

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

IPC: H05K1/02 ,  B41J2/175

Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

公开(公告)号：US20190200453A1

公开(公告)日：2019-06-27

申请号：US16287949

申请日：2019-02-27

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

IPC: H05K1/02 ,  B41J2/175

CPC classification number: H05K1/0272 ,  B41J2/17506 ,  B41J2/17513 ,  B41J2/1753 ,  H05K1/0212 ,  Y10T137/6416

Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

公开(公告)号：US11523500B2

公开(公告)日：2022-12-06

申请号：US16287949

申请日：2019-02-27

Applicant: STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

IPC: H05K1/02 ,  B41J2/175

Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.