公开(公告)号：US20040218876A1

公开(公告)日：2004-11-04

申请号：US10739924

申请日：2003-12-18

Applicant: STMicroelectronics S.A.

Inventor： Olivier Franiatte

IPC: G02B006/36

CPC classification number: H04N5/2254

Abstract: An optical system with an optical package capable of being assembled in advance. The optical package comprises a body that contains an integrated-circuit chip having an optical sensor on its front face, a ring and an optical device intended to be placed in front of the said optical sensor. Adhesive is deposited on the internal thread (3) of the ring (2) and/or on the external thread (7) of the optical device (5). The optical device (5) is screwed into the ring (2) as far as an entered position. The ring (2), which is provided with the optical device (5), is affixed to the body (12) of the package (11). In order to bring the optical device (5) to an adjustment position relative to the said optical sensor (14), the said adjustment position being away from its entered position, the optical device is unscrewed relative to the ring. A treatment (19) is then applied to the adhesive (10) so as to fix the optical device (5) in the said ring (2) at the adjustment position reached.

Abstract translation: 具有能够预先组装的光学封装的光学系统。 该光学封装包括一个主体，该主体包含在其正面上具有光学传感器的集成电路芯片，一个环和一个旨在放置在所述光学传感器前面的光学装置。 粘合剂沉积在环（2）的内螺纹（3）和/或光学装置（5）的外螺纹（7）上。 光学装置（5）旋入到环（2）中，直到输入的位置。 设置有光学装置（5）的环（2）固定到包装（11）的主体（12）上。 为了使光学装置（5）相对于所述光学传感器（14）进入调整位置，所述调节位置远离其进入的位置，光学装置相对于环旋开。 然后将处理（19）施加到粘合剂（10），以便在达到的调节位置将光学装置（5）固定在所述环（2）中。