公开(公告)号：US20030107825A1

公开(公告)日：2003-06-12

申请号：US10171453

申请日：2002-06-13

Applicant: STMicroelectronics S.r.I. ,  STMicroelectronics Limited

Inventor： Pierangelo Magni ,  Francesco Sala ,  Eric Christison ,  Andrea Giovanni Cigada

IPC: G02B007/02

CPC classification number: G02B7/022 ,  G02B7/04 ,  H01L31/0203 ,  H01L31/02325 ,  H04N5/2253 ,  H04N5/2254

Abstract: An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.

Abstract translation: 一种图像检测装置，包括：容纳传感器的主体; 第一支撑元件，与主体刚性联接并且限定座椅; 以及包括具有光轴的至少一个光学单元的目标。 所述座部形成与所述光学单元形成的对准部分直接且可滑动地接合以使光轴正交于所述传感器的引导部。

公开(公告)号：US20020093120A1

公开(公告)日：2002-07-18

申请号：US10036335

申请日：2001-12-26

Applicant: STMicroelectronics S.r.I.

Inventor： Pierangelo Magni ,  Andrea Cigada

IPC: B29C033/00

CPC classification number: H01L21/565 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract translation: 一种用于形成用于集成在半导体上的电子器件的塑料保护封装件的方法，包括要封装在保护封装中的电子电路。 电子设备可以至少部分地从保护包装的外部激活。 该方法可以包括提供具有半模的模具，其具有与模具内部邻接的插入件，端部具有能够弹性变形以抵抗与集成电路的至少一部分压接的元件。 该方法还可以包括将树脂注入到模具中，使得保护包装件通过电子电路的至少一部分具有孔。