公开(公告)号：US20210190814A1

公开(公告)日：2021-06-24

申请号：US17122793

申请日：2020-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： Jean Marie DARMANIN ,  Carlo VALZASINA ,  Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

公开(公告)号：US20230296643A1

公开(公告)日：2023-09-21

申请号：US18322488

申请日：2023-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Jean Marie DARMANIN ,  Carlo VALZASINA ,  Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

公开(公告)号：US20240044932A1

公开(公告)日：2024-02-08

申请号：US18364847

申请日：2023-08-03

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele GATTERE ,  Jean Marie DARMANIN ,  Francesco RIZZINI

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: A microelectromechanical sensor device having a sensing structure with: a substrate; an inertial mass, suspended above the substrate and elastically coupled to a rotor anchoring structure by elastic coupling elements, to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes, integrally coupled to the inertial mass to be movable due to the inertial movement; and second sensing electrodes, fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes are arranged in a suspended manner above the substrate and a compensation structure is configured to move the second sensing electrodes with respect to the first sensing electrodes and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure.

公开(公告)号：US20230028797A1

公开(公告)日：2023-01-26

申请号：US17866378

申请日：2022-07-15

Applicant: STMicroelectronics S.r.l.

Inventor： Gabriele GATTERE ,  Jean Marie DARMANIN ,  Francesco RIZZINI ,  Carlo VALZASINA

IPC: G01P15/125 ,  G01P1/00

Abstract: A closed-loop microelectromechanical accelerometer includes a substrate of semiconductor material, an out-of-plane sensing mass and feedback electrodes. The out-of-plane sensing mass, of semiconductor material, has a first side facing the supporting body and a second side opposite to the first side. The out-of-plane sensing mass is also connected to the supporting body to oscillate around a non-barycentric fulcrum axis parallel to the first side and to the second side and perpendicular to an out-of-plane sensing axis. The feedback electrodes are capacitively coupled to the sensing mass and are configured to apply opposite electrostatic forces to the sensing mass.