Photonic Wafer Level Testing Systems, Devices, and Methods of Operation

    公开(公告)号:US20210270699A1

    公开(公告)日:2021-09-02

    申请号:US17318831

    申请日:2021-05-12

    Abstract: A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.

    Optical integrated circuit systems, devices, and methods of fabrication

    公开(公告)号:US10714468B2

    公开(公告)日:2020-07-14

    申请号:US16279092

    申请日:2019-02-19

    Abstract: An optical integrated circuit device includes a semiconductor substrate and a first waveguide made of a first material and disposed over the semiconductor substrate. The first waveguide includes a parallel region and a tapered region. The optical integrated circuit device further includes a first cladding structure disposed over and surrounding the parallel region of the first waveguide, a first extension made of the first material and disposed over the semiconductor substrate, and an electrostatic discharge (ESD) protection structure electrically coupled to the first extension. The first extension physically contacts the parallel region of the first waveguide. The first extension includes a first portion within the first cladding structure and a second portion outside the first cladding structure.

    Optical Integrated Circuit Systems, Devices, and Methods of Fabrication

    公开(公告)号:US20200013771A1

    公开(公告)日:2020-01-09

    申请号:US16279092

    申请日:2019-02-19

    Abstract: An optical integrated circuit device includes a semiconductor substrate and a first waveguide made of a first material and disposed over the semiconductor substrate. The first waveguide includes a parallel region and a tapered region. The optical integrated circuit device further includes a first cladding structure disposed over and surrounding the parallel region of the first waveguide, a first extension made of the first material and disposed over the semiconductor substrate, and an electrostatic discharge (ESD) protection structure electrically coupled to the first extension. The first extension physically contacts the parallel region of the first waveguide. The first extension includes a first portion within the first cladding structure and a second portion outside the first cladding structure.

    ARCHITECTURE OF AN INTEGRATED OPTICS DEVICE

    公开(公告)号:US20210041644A1

    公开(公告)日:2021-02-11

    申请号:US16535967

    申请日:2019-08-08

    Abstract: A device includes a first directional coupler and a second directional coupler. A first arched waveguide forms a first curved optical path between a first output port of the first directional coupler and a first input port of the second directional coupler. The first arched waveguide has an angle of curvature and a radius of curvature. A second arched waveguide has the angle of curvature and the radius of curvature. The first arched waveguide and the second arched waveguide each have a concavity oriented in the same direction. A first straight waveguide is coupled to a second output port of the first directional coupler and a first end of the second arched waveguide. A second straight waveguide is coupled to a second end of the second arched waveguide and a second input port of the second directional coupler.

    Photonic wafer level testing systems, devices, and methods of operation

    公开(公告)号:US12216020B2

    公开(公告)日:2025-02-04

    申请号:US17318831

    申请日:2021-05-12

    Abstract: A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.

    Optical integrated circuit systems, devices, and methods of fabrication

    公开(公告)号:US10262984B1

    公开(公告)日:2019-04-16

    申请号:US16028263

    申请日:2018-07-05

    Abstract: An optical integrated circuit device includes an electrically insulating substrate, an optical connection disposed at a boundary of the optical integrated circuit, and a first electrostatic discharge (ESD) protection structure in direct contact with and electrically coupled to the first waveguide. The optical connection includes a first waveguide. The first waveguide is disposed on the electrically insulating substrate and configured to transmit an optical signal. The first ESD protection structure is both electrically non-insulating and substantially optically transparent to the optical signal. An ESD diode including an anode and a cathode is electrically coupled to the first ESD protection structure. A ground connection is electrically coupled to the anode of the ESD diode.

    PHOTONIC WAFER LEVEL TESTING SYSTEMS, DEVICES, AND METHODS OF OPERATION

    公开(公告)号:US20250116570A1

    公开(公告)日:2025-04-10

    申请号:US18988238

    申请日:2024-12-19

    Abstract: A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.

    Architecture of an integrated optics device

    公开(公告)号:US10935738B1

    公开(公告)日:2021-03-02

    申请号:US16535967

    申请日:2019-08-08

    Abstract: A device includes a first directional coupler and a second directional coupler. A first arched waveguide forms a first curved optical path between a first output port of the first directional coupler and a first input port of the second directional coupler. The first arched waveguide has an angle of curvature and a radius of curvature. A second arched waveguide has the angle of curvature and the radius of curvature. The first arched waveguide and the second arched waveguide each have a concavity oriented in the same direction. A first straight waveguide is coupled to a second output port of the first directional coupler and a first end of the second arched waveguide. A second straight waveguide is coupled to a second end of the second arched waveguide and a second input port of the second directional coupler.

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