公开(公告)号：US09159644B2

公开(公告)日：2015-10-13

申请号：US13629156

申请日：2012-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Tommaso Casabianca ,  Cristiano Gianluca Stella

IPC: H01L23/433 ,  H01L23/495 ,  H01L21/56 ,  A01B1/00

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.

Abstract translation: DSC型器件制造工艺包括将电路组件放置在模具中。 电路组件包括第一散热器，安装在第一散热器上的半导体芯片，安装在半导体芯片上的第二散热器和与半导体芯片电连接的引脚块。 第一散热器的外表面和销块的外表面与模具的第一内表面接触。 间隔件插入件放置成与模具的第二内表面和第二散热器的外表面接触并定位在模具的第二内表面之间。 模具填充有随后硬化的绝缘材料。 硬化后，从第一散热器，销块和第二散热片的外表面暴露出来，从模具中取出所得装置。

公开(公告)号：US20130154155A1

公开(公告)日：2013-06-20

申请号：US13629156

申请日：2012-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Tommaso Casabianca ,  Cristiano Gianluca Stella

IPC: B29C45/14

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.

Abstract translation: DSC型器件制造工艺包括将电路组件放置在模具中。 电路组件包括第一散热器，安装在第一散热器上的半导体芯片，安装在半导体芯片上的第二散热器和与半导体芯片电连接的引脚块。 第一散热器的外表面和销块的外表面与模具的第一内表面接触。 间隔件插入件放置成与模具的第二内表面和第二散热器的外表面接触并定位在模具的第二内表面之间。 模具填充有随后硬化的绝缘材料。 硬化后，从第一散热器，销块和第二散热片的外表面暴露出来，从模具中取出所得装置。