公开(公告)号：US20190245258A1

公开(公告)日：2019-08-08

申请号：US16317082

申请日：2016-07-12

Applicant: STMicroelectronics SA

Inventor： Vincent KNOPIK ,  Boris MORET ,  Eric KERHERVE

IPC: H01P5/18

CPC classification number: H01P5/187 ,  H01P5/186

Abstract: A 90° hybrid inductive-capacitive coupling stage includes two first stage terminals capable of forming two stage inputs or two stage outputs and two second stage terminals capable of respectively forming two stage outputs or two stage inputs. The coupling stage is advantageously modular having a first stage axis of symmetry and a second stage axis of symmetry orthogonal to each other with neighboring inductive metal tracks being overlaid in at least one crossing region to form both an inductive circuit and a capacitive circuit. The metal tracks are coupled to the first stage terminals and to the second stage terminals such that the two first stage terminals are situated on one side of the first stage axis of symmetry and the two second stage terminals are situated on the other side of the first stage axis of symmetry.