公开(公告)号：US20200381833A1

公开(公告)日：2020-12-03

申请号：US16889240

申请日：2020-06-01

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Frederic GIANESELLO ,  Didier CAMPOS

IPC: H01Q9/04 ,  H01Q5/357 ,  H01Q1/22 ,  H01Q21/28

Abstract: A first independent unit includes a support substrate with an integrated network of electrical connections. An electronic integrated circuit chip is mounted above a front face of the support substrate. A second independent unit includes a dielectric support. The second independent unit is stacked above the first independent unit on a side of the front face of the first independent unit. An electromagnetic antenna includes an exciter element and a resonator element. The exciter element provided at the support substrate. The resonator element is provided at the dielectric support.

公开(公告)号：US20200303348A1

公开(公告)日：2020-09-24

申请号：US16818792

申请日：2020-03-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

公开(公告)号：US20190287874A1

公开(公告)日：2019-09-19

申请号：US16295132

申请日：2019-03-07

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic device includes a carrier wafer having a front side and a back side, with an electrical connection network configured to connect the front side to the back side. An electronic chip is mounted on the front side of the carrier wafer and electrically connected to front pads of the electrical connection network. A sheet of a thermally conductive graphite or a pyrolytic graphite is added to the back side of the carrier wafer. The sheet includes apertures which leave back pads of the electrical connection network uncovered.

公开(公告)号：US20220384298A1

公开(公告)日：2022-12-01

申请号：US17887046

申请日：2022-08-12

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/522 ,  H01L23/36

Abstract: A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.

公开(公告)号：US20200152586A1

公开(公告)日：2020-05-14

申请号：US16680134

申请日：2019-11-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/38 ,  H01Q1/22

Abstract: A carrier substrate includes an integrated network of electrical connections extending from a front face to a back face. An electromagnetic antenna is located on the front face of the carrier substrate and is connected to the integrated network. An electronic chip is mounted over the front face of the carrier substrate, and connected to the integrated network, at a location offset from the antenna. An encapsulation layer encapsulates the electronic chip. The encapsulation layer includes, recessed with respect to its front surface, a local void that is located laterally away from the electronic chip and extends over a zone that at least partly covers the location of the electromagnetic antenna.

公开(公告)号：US20230081711A1

公开(公告)日：2023-03-16

申请号：US17943885

申请日：2022-09-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS ,  Fabien QUERCIA ,  Justin CATANIA

IPC: B23K20/00 ,  B23K20/10

Abstract: A wire bonding tool includes a tool body with a tubular cavity extending through the tool body and a distal end. The distal end includes a flared opening at an end of the tubular cavity. The tool body further includes at least one protrusion at a level of the distal end.

公开(公告)号：US20220238492A1

公开(公告)日：2022-07-28

申请号：US17718145

申请日：2022-04-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

公开(公告)号：US20200381328A1

公开(公告)日：2020-12-03

申请号：US16889112

申请日：2020-06-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/522

Abstract: A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.