Method for producing silicon single crystal

    公开(公告)号:US11814745B2

    公开(公告)日:2023-11-14

    申请号:US16622502

    申请日:2018-06-15

    申请人: SUMCO CORPORATION

    IPC分类号: C30B15/04 C30B15/20 C30B29/06

    CPC分类号: C30B15/04 C30B15/20 C30B29/06

    摘要: A production method of monocrystalline silicon includes: growing the monocrystalline silicon having a straight-body diameter in a range from 301 mm to 330 mm that is pulled up through a Czochralski process from a silicon melt including a dopant in a form of red phosphorus; controlling a resistivity of the monocrystalline silicon at a straight-body start point to fall within a range from 1.20 mΩcm to 1.35 mΩcm; and subsequently sequentially decreasing the resistivity of the monocrystalline silicon to fall within a range from 0.7 mΩcm to 1.0 mΩcm at a part of the monocrystalline silicon.

    Method for producing silicon single crystal

    公开(公告)号:US11242617B2

    公开(公告)日:2022-02-08

    申请号:US16471219

    申请日:2017-10-30

    申请人: SUMCO CORPORATION

    摘要: A silicon single crystal production method includes pulling up and growing a silicon single crystal from silicon melt containing red phosphorus as a dopant by Czochralski process. The silicon single crystal is intended for a 200-mm-diameter wafer. The silicon single crystal includes a straight body with a diameter in a range from 201 mm to 230 mm. The straight body includes a straight-body start portion with an electrical resistivity in a range from 0.8 mΩcm to 1.2 mΩcm. A crystal rotation speed of the silicon single crystal is controlled to fall within a range from 17 rpm to 40 rpm for at least part of a shoulder-formation step for the silicon single crystal.

    Method for producing silicon single crystal

    公开(公告)号:US12116691B2

    公开(公告)日:2024-10-15

    申请号:US18376281

    申请日:2023-10-03

    申请人: SUMCO CORPORATION

    IPC分类号: C30B15/20 C30B15/04 C30B29/06

    CPC分类号: C30B15/04 C30B15/20 C30B29/06

    摘要: A production method of monocrystalline silicon includes: growing the monocrystalline silicon having a straight-body diameter in a range from 301 mm to 330 mm that is pulled up through a Czochralski process from a silicon melt including a dopant in a form of arsenic; controlling a resistivity of the monocrystalline silicon at the straight-body start point to fall within a range from 2.50 mΩcm to 2.90 mΩcm; and subsequently sequentially decreasing the resistivity of the monocrystalline silicon to fall within a range from 1.6 mΩcm to 2.0 mΩcm at a part of the monocrystalline silicon.