公开(公告)号：US20220025106A1

公开(公告)日：2022-01-27

申请号：US17296767

申请日：2019-10-16

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Hirofumi KATO ,  Kenichi TAKEUCHI

IPC分类号： C08G59/24 ,  C08G59/62 ,  C08G59/40 ,  C08G59/68 ,  C08J5/24

摘要： An epoxy resin composition and a cured product thereof are provided, the epoxy resin composition comprising an epoxy resin (A), a curing agent (B) comprising a compound represented by the following formula (B-1) (wherein R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms), and an imidazole adduct-type curing accelerator (C), wherein the molar ratio of the content of a phenolic hydroxide group to the content of an epoxy group in the epoxy resin composition is 0.25 to 0.67.

公开(公告)号：US20240254279A1

公开(公告)日：2024-08-01

申请号：US18289335

申请日：2022-05-11

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Kenichi TAKEUCHI ,  Hirofumi KATO

IPC分类号： C08G59/24 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08K5/55

CPC分类号： C08G59/245 ,  C08G59/4007 ,  C08G59/5073 ,  C08G59/621 ,  C08K5/55

摘要： There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), an imidazole adduct-type curing accelerator (C), and a Lewis acid compound (D) having a boron atom or an aluminum atom, wherein the curing agent (B) comprises a compound (B-1) represented by a formula (B-1) [R1 denotes a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms]; and the content of a compound (B-2) represented by a formula (B-2) [R2 denotes a hydrogen atom, a halogen atom, a methyl group or a methoxy group] in the curing agent (B) is 0 parts by mass or higher and lower than 2.0 parts by mass based on 100 parts by mass of the epoxy resin (A).

公开(公告)号：US20230212385A1

公开(公告)日：2023-07-06

申请号：US17927561

申请日：2021-05-14

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Kenichi TAKEUCHI ,  Hirofumi KATO

IPC分类号： C08L63/00 ,  C08K5/3445 ,  C08K5/13 ,  C08K5/1545 ,  C08J5/24

CPC分类号： C08L63/00 ,  C08K5/3445 ,  C08K5/13 ,  C08K5/1545 ,  C08J5/24 ,  C08J2363/00

摘要： Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).