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1.发明授权公开(公告)号：US10263410B2
公开(公告)日：2019-04-16
申请号：US15573534
申请日：2017-01-10
发明人： Ryota Fukumoto , Satoshi Yamasaki , Shinya Nishikawa , Yuuki Yabe
IPC分类号： H01R4/00 , H02G15/04 , B32B7/02 , B32B1/08 , H01B7/282 , H01R4/02 , H01R4/72 , H01B13/32 , H01R4/22 , H02G15/18
摘要： A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.
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2.发明授权公开(公告)号：US10269472B2
公开(公告)日：2019-04-23
申请号：US15316538
申请日：2015-07-07
IPC分类号： H01B13/22 , H01B7/282 , B32B7/02 , B32B7/12 , B32B1/08 , H02G15/04 , C09J123/06 , C09J123/08 , C09J177/00 , H01B7/00 , H02G3/04 , B32B27/08 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B3/20 , B32B7/05 , C09J201/00
摘要： A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.
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3.发明授权公开(公告)号：US10224705B2
公开(公告)日：2019-03-05
申请号：US15573534
申请日：2017-01-10
发明人： Ryota Fukumoto , Satoshi Yamasaki , Shinya Nishikawa , Yuuki Yabe
IPC分类号： H01R4/00 , H02G15/04 , B32B7/02 , B32B1/08 , H01B7/282 , H01R4/02 , H01R4/72 , H01B13/32 , H01R4/22 , H02G15/18
摘要： A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.
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