摘要:
A multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on an inner side of the base material layer 10. The adhesive layer 11 does not flow at a temperature of 135° C. and includes a thermoplastic resin and a viscosity characteristics modifier composed of at least one selected from the group consisting of silica, an organically treated layered silicate, and a deterioration inhibitor. In the case where the multilayered heat-recoverable article 1 is used to cover an insulated electrical wire which includes a conductor and a polyvinyl chloride layer provided on the outer periphery thereof, cracks do not occur in the polyvinyl chloride layer under heating conditions at 135° C. for 200 hours.
摘要翻译:多层可热回收物品1包括基材层10和设置在基材层10的内侧的粘合剂层11.粘合剂层11在135℃的温度下不流动,并且包括热塑性树脂 和由选自二氧化硅,有机处理层状硅酸盐和劣化抑制剂中的至少一种组成的粘度特性改性剂。 在多层可热回收物品1用于覆盖包括导体的绝缘电线和设置在其外周的聚氯乙烯层的情况下,在135℃的加热条件下不会在聚氯乙烯层中发生裂纹 C. 200小时。
摘要:
Provided are a multilayered heat-recoverable article which can be used for many types of adherend and which is suitable for improving the convenience of the user, and a wire harness and a wire splice, each including the multilayered heat-recoverable article. According to the present invention, a multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on the inner side of the base material layer 10. The adhesive layer 11 includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layer 11 is 300 Pa·s or more at a shear rate of 0.1 s−1 and 200 Pa·s or less at a shear rate of 100 s−1.
摘要:
A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.
摘要:
A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.
摘要:
A transparent polyamide resin composition includes a transparent polyamide resin which is a copolymer of an alicyclic diamine and a dicarboxylic acid and which has a refractive index of 1.500 to 1.550, and a transparent crosslinking auxiliary having a refractive index of 1.500 to 1.550, in which the amount of the crosslinking auxiliary added is 13 to 26 parts by mass relative to 100 parts by mass of the transparent polyamide resin, and the crosslinking auxiliary is dispersed, as phases with a diameter of 350 nm or less, in the transparent polyamide resin. A crosslinked transparent polyamide resin molded body is obtained by molding the transparent polyamide resin composition and crosslinking the transparent polyamide resin.
摘要:
An object of the present invention is to provide a heat-recoverable article that thermally shrinks in a suitable temperature range and that does not easily split, and a wire splice and a wire harness that use the heat-recoverable article. The heat-recoverable article according to the present invention is a cylindrical, heat-recoverable article including a base layer. The base layer contains two or more polyolefin-based resins and a flame retardant, the base layer has a single melting-point peak temperature, the melting-point peak temperature is 112° C. or more and 128° C. or less, and a heat of fusion of the base layer is 60 J/g or more and 85 J/g or less. A heat of fusion of a total resin component of the base layer is preferably 80 J/g or more and 135 J/g or less.
摘要:
Provided is a thermally restorable article which has a good filling property when thermally shrunk to improve adhesiveness with a base to be treated, and in which the variation in the thickness of an adhesive layer during extrusion molding can be reduced. A multilayer thermally restorable article includes an adhesive layer composed of an adhesive composition that contains a thermoplastic resin having a melt flow rate of 15 g/10 min or more and 1,000 g/10 min or less at 190° C. and at a load of 2.16 kg, and an organically treated layered silicate, and that has a shear viscosity of 1,000 Pa·s or more at a temperature of 150° C. and at a shear rate of 0.1 s−1; and an outer layer disposed on an outer periphery of the adhesive layer. More preferably, a shear viscosity of the adhesive composition at a temperature of 150° C. and at a shear rate of 100 s−1 is 200 Pa·s or less.
摘要:
A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.
摘要:
A multilayered heat-recoverable article according to the present invention includes a cylindrical base material layer and an adhesive layer disposed on an inner peripheral surface of the base material layer, in which the base material layer contains a polyethylene and an oxidation inhibitor, the adhesive layer contains an ethylene-vinyl acetate copolymer and an oxidation inhibitor, the oxidation induction temperature of the base material layer is 255° C. to 270° C., and the oxidation induction temperature of the adhesive layer is 255° C. or higher.
摘要:
It is an object of the present invention to provide a heat-recoverable article which heat-shrinks in an appropriate temperature range, in which the occurrence of bloom and bleeding is small, and which has excellent resistance to copper-induced damage; and a wire splice and a wire harness each including the heat-recoverable article. A heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer, in which the base material layer contains an antioxidant and two or more polyolefin resins, the base material layer has one melting-point peak temperature, the melting-point peak temperature is 112° C. to 128° C., the heat of fusion of all of the resin components of the base material layer is 80 to 130 J/g, and the oxidation induction temperature of the base material layer is 265° C. to 280° C.