公开(公告)号：US10739624B2

公开(公告)日：2020-08-11

申请号：US16367762

申请日：2019-03-28

Applicant: Sumitomo Osaka Cement Co., Ltd.

Inventor： Yuji Yamane ,  Tetsuya Fujino ,  Hideki Ichimei

IPC: G02F1/035

Abstract: An optical control element including an optical waveguide formed by using diffusion of titanium that is formed on a lithium niobate substrate and a control electrode formed on the lithium niobate substrate that is provided in the vicinity of the optical waveguide, in which an amount of a hydroxyl group absorbed into the lithium niobate substrate is set to be in a range of 0.5 to 2.5 cm−1.

公开(公告)号：US11586061B2

公开(公告)日：2023-02-21

申请号：US17212971

申请日：2021-03-25

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Hideki Ichimei ,  Kei Kato ,  Norikazu Miyazaki

IPC: G02F1/035 ,  G02F1/03

Abstract: An optical waveguide device includes a substrate on which an optical waveguide is formed, and a reinforcing block disposed on the substrate, along an end surface of the substrate on which an input portion or an output portion of the optical waveguide is disposed, in which an optical component that is joined to both the end surface of the substrate and an end surface of the reinforcing block is provided, a material used for a joining surface of the optical component and a material used for the substrate or the reinforcing block have at least different linear expansion coefficients of a direction parallel to the joining surface, and an area of the joining surface is set to be smaller than a maximum value of a total of areas of cross sections of the substrate and the reinforcing block parallel to the joining surface.

公开(公告)号：US20240201455A1

公开(公告)日：2024-06-20

申请号：US18555920

申请日：2021-09-30

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Kei Katou ,  Hideki Ichimei

IPC: G02B6/42

CPC classification number: G02B6/4204 ,  G02B6/4244

Abstract: Mechanical strength of a lens that optically couples an optical waveguide and an optical fiber provided on a substrate is improved. A lens unit that optically couples an optical waveguide provided on a substrate and an optical fiber has a lens portion and a holding portion that holds the lens portion, and the holding portion has a thick portion, along one side surface that is not a surface through which an optical axis passes, in which a thickness measured in a direction of the optical axis is larger than a thickness of an other portion of the holding portion.

公开(公告)号：US11215754B2

公开(公告)日：2022-01-04

申请号：US16697219

申请日：2019-11-27

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yuji Yamane ,  Norikazu Miyazaki ,  Yu Kataoka ,  Hideki Ichimei

IPC: G02B6/122 ,  G02B6/13 ,  G02B6/30 ,  G02B6/293 ,  G02B6/14 ,  G02B6/12

Abstract: An optical waveguide element includes an optical waveguide which is formed on one surface of a substrate, an incidence part for light to be incident on the optical waveguide or an emission part for emitting light from the optical waveguide which is disposed in an end portion of the substrate, and a dielectric film which is formed on the optical waveguide of at least one of the incidence part and the emission part, and the vicinity thereof. Regarding the dielectric film, dielectric films including a dielectric film formed of a first material having an index of refraction higher than an index of refraction of the substrate and a dielectric film formed of a second material having an index of refraction lower than the index of refraction of the substrate are alternately laminated.

公开(公告)号：US10890788B2

公开(公告)日：2021-01-12

申请号：US16364449

申请日：2019-03-26

Applicant: Sumitomo Osaka Cement Co., Ltd.

Inventor： Hideki Ichimei ,  Toshio Kataoka

IPC: G02F1/035

Abstract: An optical waveguide device module includes an optical waveguide device and a connection substrate provided outside the optical waveguide device, and these are housed in a housing. The optical waveguide device has a control electrode including a signal electrode and ground electrodes disposed to interpose the signal electrode between the ground electrodes. A signal line, ground lines disposed so as to interpose the signal line between the ground lines, and a back surface ground electrode disposed on a surface of the connection substrate are provided on the connection substrate. The ground line and the back surface ground electrode are electrically connected through a via hole passing through the connection substrate. Electrical connection means for electrically connecting the ground line and the ground electrode is provided. A connection portion of the electrical connection means on the ground line side is in the vicinity of the via hole of the ground line.