摘要:
Provided is a novel production method capable of easily producing a cyclic disulfonic acid ester compound. This method for producing a cyclic disulfonic acid ester compound comprises reacting a specific sulfonic acid compound with a specific sulfuric acid ester compound.
摘要:
Provided is a novel production method capable of easily producing a methylene disulfonate compound. The method for producing a methylene disulfonate compound comprises reacting a specific sulfonic acid compound with a formaldehyde compound in the presence of sulfur trioxide.
摘要:
There is provided a laminate having excellent partial discharge resistance. A laminate of a conductor and an insulating coating comprising a conductor and an insulating coating formed on the conductor, wherein the insulating coating is formed of a resin composition containing a metal oxide hydrate, and an inorganic insulating layer is formed on the insulating coating when the laminate is exposed to partial discharge caused by inverter surges.
摘要:
The present invention provides a heat dissipation film having high mechanical strength and flexibility, which is obtained by laminating a heat emission layer excellent in heat dissipation by infrared radiation, electrical insulation, and heat resistance on a metal film having excellent heat transfer efficiency. The present invention also provides a dispersion for heat emission layers for use in the production of the heat dissipation film, a method for producing a heat dissipation film using the dispersion for heat emission layers, and a solar cell including the heat dissipation film. The present invention provides a heat dissipation film including a heat transfer layer; and a flexible heat emission layer laminated on the heat transfer layer, the heat transfer layer being a metal film, the heat emission layer containing a water-insoluble inorganic compound and a heat-resistant synthetic resin, the amount of the water-insoluble inorganic compound in the heat emission layer being 30 to 90% by weight relative to the total weight of the heat emission layer, the heat emission layer having a thermal emissivity of at least 0.8 and a dielectric breakdown strength of at least 10 kV/mm.