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公开(公告)号：US11075102B2
公开(公告)日：2021-07-27
申请号：US15806950
申请日：2017-11-08
发明人： Sven Hansen , Georg Fink , Henrik Petry
IPC分类号： H01L21/68 , H01L21/687 , H01L21/683 , H01L21/67 , H01L23/00
摘要： The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.
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公开(公告)号：US10101672B2
公开(公告)日：2018-10-16
申请号：US15166431
申请日：2016-05-27
发明人： Sven Hansen , Henrik Petry
摘要： A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.
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公开(公告)号：US20180138070A1
公开(公告)日：2018-05-17
申请号：US15806950
申请日：2017-11-08
发明人： Sven Hansen , Georg Fink , Henrik Petry
IPC分类号： H01L21/68 , H01L21/67 , H01L21/687 , H01L23/00
CPC分类号： H01L21/68 , H01L21/67017 , H01L21/67092 , H01L21/67126 , H01L21/682 , H01L21/6838 , H01L21/68735 , H01L21/68742 , H01L24/75 , H01L24/83 , H01L2224/75101 , H01L2224/75704 , H01L2224/75724 , H01L2224/75755 , H01L2224/75981 , H01L2224/83091 , H01L2224/83136 , H01L2224/838
摘要： The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.
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公开(公告)号：US20160370715A1
公开(公告)日：2016-12-22
申请号：US15166431
申请日：2016-05-27
发明人： Sven Hansen , Henrik Petry
IPC分类号： G03F7/20
CPC分类号： G03F7/70733 , H01L21/682
摘要： A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.
摘要翻译： 公开了一种用于处理盘状基板的装置，其包括具有用于盘形基板的支撑面的支撑件和支撑适配器，支撑适配器可联接到支撑件并且可以支撑用于处理盘形基板的掩模 ，其中提供了一种接口，其检测所述支撑适配器与所述支撑件的耦合，并且其中提供与所述接口配合的控制系统，并且检测所述支撑适配器是否耦合到所述支撑件，特别是所述接口是否被占用。 还公开了一种用于这种装置的支撑适配器。
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