公开(公告)号：US11862929B2

公开(公告)日：2024-01-02

申请号：US17165744

申请日：2021-02-02

Applicant: SZ DJI TECHNOLOGY CO., LTD.

Inventor： Xiang Liu ,  Guoguang Zheng ,  Xiaoping Hong ,  Mingyu Wang ,  Shuai Dong

IPC: H01S5/02255 ,  H01S5/02253

CPC classification number: H01S5/02255 ,  H01S5/02253

Abstract: The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.