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    Torsion spring probe contactor design
    2.
    发明授权
    Torsion spring probe contactor design 有权
    扭力弹簧探头接触器设计

    公开(公告)号：US07724010B2

    公开(公告)日：2010-05-25

    申请号：US11983521

    申请日：2007-11-09

    申请人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    发明人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    IPC分类号： G01R1/073

    CPC分类号： G01R1/06727 ,  G01R1/06738 ,  G01R3/00

    摘要： The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

    摘要翻译： 本发明涉及一种用于与微电子器件上的接触焊盘进行电连接的探针。 具有长度，厚度，宽度，近端和远端的脚连接到基底。 脚的长度大于其宽度。 具有长度，宽度，厚度，近端和远端的扭杆在扭杆的近端处连接到脚的远端。 扭杆位于第一平面内。 具有长度，宽度和厚度的间隔件连接到扭杆的远端。 具有长度，宽度，厚度，近端和远端的臂在臂近端处连接到所述间隔件。 臂位于第二平面中，第二平面位于与第一平面不同的平面上。 具有顶侧和底侧的第一柱连接到臂的远端附近的臂。 尖端电连接到柱的顶侧。

    Torsion spring probe contactor design
    4.
    发明授权
    Torsion spring probe contactor design 有权

    公开(公告)号：US07362119B2

    公开(公告)日：2008-04-22

    申请号：US11194801

    申请日：2005-08-01

    申请人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    发明人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    IPC分类号： G01R1/073

    CPC分类号： G01R1/06727 ,  G01R1/06738 ,  G01R3/00

    摘要： The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

    Process for forming microstructures
    5.
    发明申请
    Process for forming microstructures 有权
    微结构形成工艺

    公开(公告)号：US20060134820A1

    公开(公告)日：2006-06-22

    申请号：US11102982

    申请日：2005-04-11

    申请人： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

    发明人： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

    IPC分类号： H01L21/00 ,  H01L21/44

    CPC分类号： B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

    摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    摘要翻译： 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    Process for forming MEMS
    6.
    发明申请
    Process for forming MEMS 有权
    MEMS成型工艺

    公开(公告)号：US20060134819A1

    公开(公告)日：2006-06-22

    申请号：US11019912

    申请日：2004-12-21

    申请人： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

    发明人： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

    IPC分类号： H01L21/00 ,  H01L21/302

    CPC分类号： B81C1/00666 ,  B81C2201/0109 ,  B81C2201/0197

    摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    摘要翻译： 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    Torsion spring probe contactor design
    8.
    发明申请
    Torsion spring probe contactor design 有权
    扭力弹簧探头接触器设计

    公开(公告)号：US20080106289A1

    公开(公告)日：2008-05-08

    申请号：US11983521

    申请日：2007-11-09

    申请人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    发明人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    IPC分类号： G01R1/067

    CPC分类号： G01R1/06727 ,  G01R1/06738 ,  G01R3/00

    摘要： The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

    摘要翻译： 本发明涉及一种用于与微电子器件上的接触焊盘进行电连接的探针。 具有长度，厚度，宽度，近端和远端的脚连接到基底。 脚的长度大于其宽度。 具有长度，宽度，厚度，近端和远端的扭杆在扭杆的近端处连接到脚的远端。 扭杆位于第一平面内。 具有长度，宽度和厚度的间隔件连接到扭杆的远端。 具有长度，宽度，厚度，近端和远端的臂在臂近端处连接到所述间隔件。 臂位于第二平面中，第二平面位于与第一平面不同的平面上。 具有顶侧和底侧的第一柱连接到臂的远端附近的臂。 尖端电连接到柱的顶侧。

    Torsion spring probe contactor design
    10.
    发明申请
    Torsion spring probe contactor design 有权
    扭力弹簧探头接触器设计

    公开(公告)号：US20070024298A1

    公开(公告)日：2007-02-01

    申请号：US11194801

    申请日：2005-08-01

    申请人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    发明人： Melvin Khoo ,  Nim Tea ,  Salleh Ismail ,  Yang Hsu ,  Weilong Tang ,  Raffi Garabedian

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06727 ,  G01R1/06738 ,  G01R3/00

    摘要： The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

    摘要翻译： 本发明涉及一种用于与微电子器件上的接触焊盘进行电连接的探针。 具有长度，厚度，宽度，近端和远端的脚连接到基底。 脚的长度大于其宽度。 具有长度，宽度，厚度，近端和远端的扭杆在扭杆的近端处连接到脚的远端。 扭杆位于第一平面内。 具有长度，宽度和厚度的间隔件连接到扭杆的远端。 具有长度，宽度，厚度，近端和远端的臂在臂近端处连接到所述间隔件。 臂位于第二平面中，第二平面位于与第一平面不同的平面上。 具有顶侧和底侧的第一柱连接到臂的远端附近的臂。 尖端电连接到柱的顶侧。