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公开(公告)号：US20220328439A1
公开(公告)日：2022-10-13
申请号：US17713248
申请日：2022-04-05
发明人： Myong Soo OH , Hee Jong SHIN , Hyun Chul JIN
IPC分类号： H01L23/00
摘要： A display device includes a display area; a pad area including a first pad for supplying a data signal to the display area, second pads for transmitting a DC signal, and a dummy pad, wherein each of the first pad, the second pads, and the dummy pad has a surface as a top face thereof, wherein each of the surface of the first pad, the surface of the second pads, and the surface of the dummy pad has a corresponding vertical level in a thickness direction of the display device, wherein the vertical level of the surface of each of the second pads is higher than the vertical level of the surface of the first pad, wherein the vertical level of the surface of the dummy pad is lower than or equal to the vertical level of the surface of the first pad.
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公开(公告)号：US20220352117A1
公开(公告)日：2022-11-03
申请号：US17866915
申请日：2022-07-18
发明人： Min Sung KIM , Myong-Soo OH , Jun O SONG , Hee Jong SHIN
IPC分类号： H01L23/00 , H01L51/52 , G02F1/1345 , G02F1/13
摘要： A method for manufacturing a display device includes checking a particle positioned between a display panel and a connecting member, irradiating a laser to an upper surface of the connecting member overlapping at least a part of the particle, removing the connecting member overlapping a region to which the laser is irradiated, removing the particle overlapping a region to which the laser is irradiated, and disposing a desiccant in a hole formed by removing the connecting member and the particle.
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公开(公告)号：US20210125956A1
公开(公告)日：2021-04-29
申请号：US17038682
申请日：2020-09-30
发明人： Min Sung KIM , Myong-Soo OH , Jun O SONG , Hee Jong SHIN
IPC分类号： H01L23/00 , H01L51/52 , G02F1/1345 , G02F1/13
摘要： A method for manufacturing a display device includes checking a particle positioned between a display panel and a connecting member, irradiating a laser to an upper surface of the connecting member overlapping at least a part of the particle, removing the connecting member overlapping a region to which the laser is irradiated, removing the particle overlapping a region to which the laser is irradiated, and disposing a desiccant in a hole formed by removing the connecting member and the particle.
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公开(公告)号：US20230133340A1
公开(公告)日：2023-05-04
申请号：US18147990
申请日：2022-12-29
发明人： Myong Soo OH , Doo San PARK , Hyun Chul JIN , Hee Jong SHIN
摘要： A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.
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公开(公告)号：US20220197069A1
公开(公告)日：2022-06-23
申请号：US17553560
申请日：2021-12-16
发明人： Myong Soo OH , Hee Jong SHIN , Hyun Chul JIN
IPC分类号： G02F1/1345 , G02F1/1362 , H05K1/02
摘要： The display device comprises a first base portion including display and non-display areas and a pad area, and a printed circuit film attached to the pad area of the first base portion, wherein pad electrodes on the first base portion and a first panel alignment mark on one side of the plurality of pad electrodes are disposed in the pad area, a first protective layer is on the pad electrodes, and a first open portion that exposes a portion of an upper surface of each pad electrode is defined in the protective layer, the printed circuit film includes a third base portion and lead electrodes on a lower surface of the third base portion and connected to the pad electrodes, and the first panel alignment mark includes a first panel alignment metal portion and a second open portion and surrounded by the first panel alignment metal portion on a plane.
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