公开(公告)号：US12015007B2

公开(公告)日：2024-06-18

申请号：US18074671

申请日：2022-12-05

申请人： Samsung Display Co., LTD.

发明人： Hong Am Kim ,  Young Min Cho

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L24/73 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/17515 ,  H01L2224/29078 ,  H01L2224/29083 ,  H01L2224/29193 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06596

摘要： A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball, and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

公开(公告)号：US11545461B2

公开(公告)日：2023-01-03

申请号：US17245167

申请日：2021-04-30

申请人： Samsung Display Co., LTD.

发明人： Hong Am Kim ,  Young Min Cho

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/18

摘要： A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball; and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.