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公开(公告)号：US11600687B2
公开(公告)日：2023-03-07
申请号：US17198947
申请日：2021-03-11
发明人： Seung Hwan Cheong , Sung Bae Park , Myung Joon Yoon , Kyu Min Han
IPC分类号： H01L23/552 , H01L27/32 , H01L23/31 , H01L23/498 , G06F3/147
摘要： An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.
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公开(公告)号：US11751331B2
公开(公告)日：2023-09-05
申请号：US17389564
申请日：2021-07-30
发明人： Kyu Min Han , Seung Hwan Cheong
CPC分类号： H05K1/118 , H05K1/0218 , H05K2201/0715 , H05K2201/10128
摘要： A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.
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