APPARATUS AND METHOD FOR MEASURING DEPOSITION RATE
    2.
    发明申请
    APPARATUS AND METHOD FOR MEASURING DEPOSITION RATE 有权
    测量沉积速率的装置和方法

    公开(公告)号:US20160245745A1

    公开(公告)日:2016-08-25

    申请号:US14860888

    申请日:2015-09-22

    CPC classification number: G01N21/53 C23C14/544 G01F1/00

    Abstract: An apparatus for measuring a deposition rate includes a light source unit in a deposition region between a deposition source and a substrate in a vacuum chamber, the light source unit emits a monochromatic light toward a deposition material released from the deposition source, a photosensor unit that measures at least one of light absorption, scattering, and emission in the deposition region when light emitted from the light source unit passes through the deposition region, and a multi-pass forming unit defining a multi-pass path between the light source unit and the photosensor unit.

    Abstract translation: 一种用于测量沉积速率的装置包括在真空室中的沉积源和衬底之间的沉积区域中的光源单元,光源单元向从沉积源释放的沉积材料发射单色光,光电传感器单元, 当从光源单元发射的光通过沉积区域时,测量沉积区域中的光吸收,散射和发射中的至少一种;以及多通道形成单元,其限定光源单元和光源单元之间的多通路径 光传感器单元。

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