DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME

    公开(公告)号:US20210217816A1

    公开(公告)日:2021-07-15

    申请号:US17022598

    申请日:2020-09-16

    Abstract: A display panel and a manufacturing method of a display panel are provided. A display panel includes: a base substrate in which a pixel area and a peripheral area adjacent to the pixel area are defined; a light emitting element located on the base substrate to overlap the pixel area, and configured to generate first light; a light control layer on the light emitting element; a color filter layer on the light control layer; and a capping layer contacting at least the light control layer and including silicon oxynitride (SiON), and the capping layer contains about 34 at % to about 41 at % of oxygen, and about 18 at % to about 25 at % of nitrogen. Luminous efficiency of the display panel may be increased while maintaining durability of the display panel.

    DISPLAY PANEL AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210111373A1

    公开(公告)日:2021-04-15

    申请号:US16997212

    申请日:2020-08-19

    Abstract: A display panel includes a light emitting element and an encapsulation layer on the light emitting element. The encapsulation layer covers the light emitting element. The encapsulation layer includes a plurality of polymer layers including a block copolymer. The plurality of polymer layers includes a plurality of first polymer layers, each of which has a first refractive index, and a plurality of second polymer layers, each of which has a second refractive index greater than the first refractive index. A difference between the first refractive index and the second refractive index is in a range of about 0.1 to about 0.6.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220238851A1

    公开(公告)日:2022-07-28

    申请号:US17496139

    申请日:2021-10-07

    Abstract: A method of manufacturing a display device includes forming a light emitting structure on a substrate and forming a thin film encapsulation layer on the light emitting structure by chemical vapor deposition equipment. The forming the thin film encapsulation layer includes forming a first inorganic layer and performing a first plasma treatment on a first portion of the first inorganic layer which is opposite to a second portion of the first inorganic layer facing the light emitting structure. A first raw material in the forming the first inorganic layer includes hydrogen. A second raw material in the performing the first plasma treatment exclusively consists of hydrogen.

Patent Agency Ranking