公开(公告)号：US09295164B2

公开(公告)日：2016-03-22

申请号：US14016933

申请日：2013-09-03

申请人： Samsung Display Co., Ltd.

发明人： An-Ho Jee ,  Seok-Hoon Yoon ,  Jong-Heon Han ,  Young-Hoon Lee

IPC分类号： H05K3/20 ,  H05K3/32 ,  H05K1/18

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2203/166 ,  Y10T156/10

摘要： A method of bonding a flexible printed circuit board (FPCB). The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.

摘要翻译： 一种粘合柔性印刷电路板（FPCB）的方法。 该方法包括在面板的连接单元上设置接合材料，将FPCB的连接单元设置在接合材料上; 在FPCB的连接单元上设置导热片; 并将FPCB的连接单元加热并按压到面板的连接单元上。 导热片包括形成在导热片中的通孔或形成在导热片的底表面中的凹槽。 在对FPCB的连接单元进行加热和加压的操作中，FPCB的延伸部分被接纳到导热片中的通孔或凹槽中。