公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

申请人： Meta Platforms Technologies, LLC

发明人： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC分类号： H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC分类号： H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

摘要： The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

公开(公告)号：US20180302980A1

公开(公告)日：2018-10-18

申请号：US15850129

申请日：2017-12-21

申请人： MC10, Inc.

发明人： William J. Arora ,  Roozbeh Ghaffari

IPC分类号： H05K1/02 ,  H05K1/00 ,  H01L23/52 ,  H01L25/16 ,  H01L23/31 ,  H01L23/528 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/0283 ,  A61F2/958 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/52 ,  H01L23/528 ,  H01L23/564 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/00 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/09263 ,  H05K2201/10106 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

摘要： In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the un-stretched distance.

公开(公告)号：US09999138B2

公开(公告)日：2018-06-12

申请号：US15351891

申请日：2016-11-15

申请人： Commissariat a L'Energie Atomique et aux Energies Alternatives

发明人： Stephan Borel

IPC分类号： H05K3/40 ,  H01L21/78 ,  H05K3/32 ,  H01L23/498

CPC分类号： H05K3/4092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/02317 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/1146 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/119 ,  H01L2224/13008 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06565 ,  H05K3/326 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/01022 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012

摘要： A method of making connection elements for a microelectronic device is provided, including foil ling a conducting layer on a support on which there is at least one conducting pad located on a front face of the support opposite a back face thereof, the conducting layer including a first conducting portion in contact with at least one conducting pad, the first conducting portion extending on the front face and being connected to at least one second conducting portion extending in contact with at least one given wall of the support being located between the front and back faces and forming a non-zero angle with the front face; thinning the support at the back face to release one conducting end of the second conducting portion as a free conducting end projecting from the back face; and after the thinning, bending the free conducting end projecting from the back face.

公开(公告)号：US20170331208A1

公开(公告)日：2017-11-16

申请号：US15667170

申请日：2017-08-02

申请人： Hamilton Sundstrand Corporation

发明人： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC分类号： H01R12/70 ,  H01R13/52 ,  H05K1/18 ,  H05K3/32 ,  H01R43/20

CPC分类号： H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

摘要： A method for fabricating a circuit board apparatus includes providing a circuit board that has a socket with at least one plated through-hole and providing a connector that has a housing with first and second connector interfaces that have, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and interior of the housing to the second connector contact at the second connector interface. The first connector contact is inserted through the resilient seal and into the plated through-hole such that the resilient seal intimately seals around the first connector contact to provide a barrier at the first connector interface into the vapor path.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

申请人： Northrop Grumman Systems Corporation

发明人： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC分类号： H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

摘要： A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US20170181338A1

公开(公告)日：2017-06-22

申请号：US14973510

申请日：2015-12-17

申请人： Intel Corporation

发明人： YOSHIHIRO TOMITA ,  JOSHUA D. HEPPNER

IPC分类号： H05K13/00 ,  H05K1/03 ,  B23P19/04

CPC分类号： H05K13/0069 ,  B23P19/04 ,  H01L23/40 ,  H01L23/4985 ,  H01L23/544 ,  H01L51/003 ,  H01L51/0097 ,  H01L2223/54426 ,  H01L2223/54486 ,  H05K1/0393 ,  H05K3/326 ,  H05K13/00 ,  H05K2201/05 ,  Y10T29/49126 ,  Y10T29/53265

摘要： The present disclosure is directed to a system to manufacture an electronic circuit assembly. In one embodiment, the system includes a flexible substrate with a substrate registration feature and a carrier with a carrier registration feature. A removable fastener removably fixes the flexible substrate to the carrier by being received into the substrate registration feature and the carrier registration feature. Once the flexible substrate is removably affixed to the carrier, the carrier provides the flexible substrate with rigidity to receive at least one electronic device of the electronic circuit assembly. Other embodiments may be described and/or claimed.

公开(公告)号：US09633976B1

公开(公告)日：2017-04-25

申请号：US14090993

申请日：2013-11-26

申请人： University of Notre Dame du Lac

发明人： Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L24/67 ,  H01L23/60 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/72 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/167 ,  H01L25/18 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/81141 ,  H01L2224/81224 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H05K1/182 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0314 ,  H05K2201/10454 ,  H05K2201/10909 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A quilt packaging system includes a first and second electronic device each comprising a plurality of edge surfaces at least a first edge surface of which comprises one or more interconnect modules disposed thereon. The first edge surface of the second electronic device is positioned contiguous to the first edge surface of the first electronic device, and at least one of the one or more interconnect nodules disposed on the first edge surface of the first electronic device is configured to be in physical contact with at least one of the one or more interconnect nodules disposed on the first edge surface of second electronic device so as to provide an electrical connection between the first and second electronic devices at the first edge surfaces of the first and second electronic device.

公开(公告)号：US09565759B2

公开(公告)日：2017-02-07

申请号：US14700850

申请日：2015-04-30

申请人： GLOBALFOUNDRIES INC.

发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

IPC分类号： H05K1/11 ,  H01R43/16 ,  H01R12/70 ,  H01R12/71 ,  H05K3/40 ,  H01R13/24 ,  H05K3/32

CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

摘要： A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

摘要翻译： 用于微电子器件的接触结构和组件包括螺旋形的第一和第二导电触头。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

公开(公告)号：US20170006711A1

公开(公告)日：2017-01-05

申请号：US15106634

申请日：2014-11-10

申请人： ROBERT BOSCH GMBH

发明人： Uwe Liskow

IPC分类号： H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC分类号： H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

摘要： An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

摘要翻译： 电子控制模块包括印刷电路板和电气部件。 电路板具有布置在部件侧的接触区域。 电气部件具有电连接元件，其连接部分平行于部件侧延伸并且电连接到接触区域。 电路板上独立于电气部件设置适配器，并且具有在接触区域外部紧固到电路板的保持体和金属网。 卷筒纸布置在保持体上，并且具有平行于部件侧延伸的接触部分。 接触部分和连接部分位于另一个顶部并且在覆盖区域中彼此焊接。 网或连接元件通过施加到接触区域的导电材料与接触区域电接触。

公开(公告)号：US20160294083A1

公开(公告)日：2016-10-06

申请号：US14672494

申请日：2015-03-30

申请人： Hamilton Sundstrand Corporation

发明人： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC分类号： H01R12/70 ,  H01R43/20 ,  H01R13/52

CPC分类号： H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

摘要： A circuit board has a socket with at least one plated through-hole. A connector includes a housing that has first and second connector interfaces with, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and the interior of the housing to the second connector contact at the second connector interface. A resilient seal is located at the first connector interface. The first connector contact extends through the resilient seal and into the plated through-hole. The resilient seal intimately seals around the first connector contact and provides a barrier at the first connector interface into the vapor path.

摘要翻译： 电路板具有至少一个电镀通孔的插座。 连接器包括具有分别具有至少第一和第二连接器触头的第一和第二连接器接口的壳体。 第一连接器接口开口到壳体的内部，使得在第二连接器接口处存在穿过第一连接器接口的蒸气路径和壳体的内部到第二连接器触点。 弹性密封件位于第一连接器接口处。 第一连接器触头延伸穿过弹性密封件并进入电镀通孔。 弹性密封件密封地围绕第一连接器接头密封，并且在第一连接器接口处提供在蒸气路径中的阻挡层。