公开(公告)号：US20190299337A1

公开(公告)日：2019-10-03

申请号：US16354395

申请日：2019-03-15

Applicant: SAMSUNG DISPLAY CO., LTD. ,  Kyungpook National University Industry-Academic Cooperation Foundation

Inventor： HO LEE ,  Woong Kim ,  Hyoshin SONG ,  Seungsik HAM ,  Buemjoon KIM

IPC: B23K26/38 ,  B23K26/40 ,  B23K26/06 ,  B23K26/046 ,  B06B1/06

Abstract: A laser cutting apparatus includes a laser module, a vibration module, a motor module, a reflective module, and a concentrating module. The vibration module includes a lens module, and a piezoelectric module coupled to the lens module and configured to repeatedly expand and contract. The motor module is configured to move the vibration module in by transmitting power to the vibration module. The reflective module is configured to reflect the laser beam in such a way that a traveling direction of the laser beam is changed. The concentrating module is configured to concentrate the laser beam in such a way that energy of the laser beam reflected by the reflective surface is concentrated at a focal point.

公开(公告)号：US20190255725A1

公开(公告)日：2019-08-22

申请号：US16280972

申请日：2019-02-20

Applicant: Samsung Display Co., Ltd.

Inventor： Woong KIM ,  Kyungwon KANG ,  Buemjoon KIM ,  Jihoon KIM ,  Teadong KIM ,  Sungho NOH ,  Junho SIM ,  Hyungbo SHIM ,  Heesuk LEE ,  Jaeku HAN

IPC: B26D7/18 ,  B26D7/27 ,  B26D7/00 ,  B26D7/01

Abstract: A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.