Abstract:
An electronic device includes a base layer, a circuit layer disposed on the base layer and including a transistor, a plurality of inorganic films, and a plurality of organic films. A display element layer is disposed on the circuit layer. An encapsulation layer is disposed on the display element layer. An input sensor is disposed on the encapsulation layer and includes a sensor base layer, a sensor conductive layer disposed on the sensor base layer, and a sensor insulating layer disposed on the sensor base layer and including silicon nitride (SiNx). The sensor base layer includes a buffer insulating layer including silicon (Si) and oxygen (O), and an atomic percent of oxygen (O) in the buffer insulating layer is in a range of 2 at % to 67 at %.
Abstract:
An inspection system includes: an automated optical inspection device detecting a defect of an inspection object by using a light; a scanning electron microscope device for inspecting the defect of the inspection object by using an electron beam and including a vacuum chamber; a stage positioned below and spaced from the scanning electron microscope device and supporting the inspection object; and a transferring device connected to the scanning electron microscope chamber and the automated optical inspection and transferring the scanning electron microscope device and the automated optical inspection device to positions over the stage. Air is in a gap between the chamber and the inspection object. Accordingly, an inspection object of a large size may be inspected for analysis without damage to the inspection object.