公开(公告)号：US20240324325A1

公开(公告)日：2024-09-26

申请号：US18611705

申请日：2024-03-21

Applicant: Samsung Display Co., Ltd.

Inventor： Byunggoo JUNG ,  Sunil CHOI ,  Sungjun KIM ,  Wangwoo LEE

IPC: H10K59/124

CPC classification number: H10K59/124

Abstract: A display panel includes a substrate including a first area, a second area surrounding the first area, and a third area between the first area and the second area, a first pixel circuit arranged in the third area and including a first transistor, a storage capacitor, and a second transistor, a first organic insulating layer disposed on the first transistor and the second transistor, a second organic insulating layer disposed on the first organic insulating layer, a first light-emitting diode arranged in the first area and electrically connected to the first pixel circuit, the first light-emitting diode including a first electrode disposed on the second organic insulating layer, and a conductive pattern layer disposed on the first organic insulating layer in a fourth area that is a boundary between the first area and the second area, the conductive pattern layer including a plurality of holes.

公开(公告)号：US20230240094A1

公开(公告)日：2023-07-27

申请号：US18099496

申请日：2023-01-20

Applicant: Samsung Display Co., LTD. ,  IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)

Inventor： Byoung Kwon CHOO ,  Jea Gun PARK ,  Seung Bae KANG ,  Sungjun KIM ,  Sung Hoon MOON

IPC: H10K59/12 ,  H10K59/131 ,  H10K59/124 ,  C09G1/02

CPC classification number: H10K59/1201 ,  H10K59/131 ,  H10K59/124 ,  C09G1/02

Abstract: Embodiments provide a slurry for polishing copper, a manufacturing method of a display device which uses the slurry, and the display device. The slurry for polishing copper includes an abrasive, a catalyst including a single molecule having an iron ion, a polishing suppressant, and an oxidizing agent.