公开(公告)号：US11670870B2

公开(公告)日：2023-06-06

申请号：US17465161

申请日：2021-09-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho Kyung Kang ,  Gil Ha Lee ,  Shin Haeng Heo ,  Hyung Ho Seo ,  Hong Cheol Kim

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q9/04 ,  H01Q1/02 ,  H01Q1/24

CPC classification number: H01Q21/065 ,  H01Q1/02 ,  H01Q1/2283 ,  H01Q9/045 ,  H01Q21/0025 ,  H01Q21/0087 ,  H01Q1/243

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.

公开(公告)号：US11228118B2

公开(公告)日：2022-01-18

申请号：US16659703

申请日：2019-10-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho Kyung Kang ,  Gil Ha Lee ,  Shin Haeng Heo ,  Hyung Ho Seo ,  Hong Cheol Kim

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q1/02 ,  H01Q1/24

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.