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公开(公告)号：US11658393B2
公开(公告)日：2023-05-23
申请号：US17354425
申请日：2021-06-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu Kim , Young Sik Hur , Yoo Sam Na , Won Gi Kim , Young Bal Kim , Soo Ki Choi , Ho Kyung Kang , Young Kyoon Im , Seong Jong Cheon
CPC classification number: H01Q1/2283 , H01Q1/085 , H01Q21/28 , H04B1/04 , H04B1/16
Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
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公开(公告)号：US10784564B2
公开(公告)日：2020-09-22
申请号：US16694228
申请日：2019-11-25
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hong In Kim , Thomas A. Kim , Ho Kyung Kang
Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
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公开(公告)号：US11888212B2
公开(公告)日：2024-01-30
申请号：US17356869
申请日：2021-06-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung Kang , Shin Haeng Heo , Hyung Ho Seo
IPC: H01Q1/24 , H01L23/13 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q21/00 , H01Q21/06
CPC classification number: H01Q1/243 , H01L23/13 , H01L23/3121 , H01L23/4985 , H01L23/49822 , H01L23/49833 , H01L23/552 , H01L23/66 , H01Q21/0006 , H01Q21/065 , H01L2223/6616 , H01L2223/6677
Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.
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公开(公告)号：US11228118B2
公开(公告)日：2022-01-18
申请号：US16659703
申请日：2019-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung Kang , Gil Ha Lee , Shin Haeng Heo , Hyung Ho Seo , Hong Cheol Kim
Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.
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公开(公告)号：US10396432B2
公开(公告)日：2019-08-27
申请号：US15817329
申请日：2017-11-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hong In Kim , Thomas A Kim , Ho Kyung Kang
Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
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Patent Agency Ranking
公开(公告)号：US11133592B2
公开(公告)日：2021-09-28
申请号：US16891200
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung Kang , Seong Jong Cheon , Hak Gu Kim , Young Sik Hur , Jin Seon Park , Yong Duk Lee
Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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公开(公告)号：US11101840B1
公开(公告)日：2021-08-24
申请号：US16994955
申请日：2020-08-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
IPC: H01L25/16 , H01L21/56 , H01L23/495 , H01L23/488 , H05K1/18 , H04B1/40 , H01Q9/04 , H01Q1/22 , H01L25/065 , H01L23/538 , H01L23/66
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US10971825B2
公开(公告)日：2021-04-06
申请号：US15994514
申请日：2018-05-31
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung Kang , ThomasA Kim
IPC: H01Q1/22 , H01Q21/06 , H01Q1/38 , H01L23/498 , H01L23/13 , H01L23/552 , H01L23/66 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/31 , H01Q9/04 , H01Q1/52 , H01L21/683 , H01L25/16 , H01L23/50
Abstract: An antenna module includes: an integrated circuit (IC) configured to generate a radio frequency (RF) signal; and a substrate including an antenna portion providing a first surface of the substrate, and a circuit pattern portion providing a second surface of the substrate. The antenna portion includes first antenna members configured to transmit the RF signal, cavities corresponding to the first antenna members, through vias respectively disposed in the cavities and respectively electrically connected to the first antenna members, and a plating member disposed in at least one cavity among the cavities. The circuit pattern portion includes a circuit pattern and an insulating layer forming, for each of the through vias, an electrical connection path to the IC.
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公开(公告)号：US11670870B2
公开(公告)日：2023-06-06
申请号：US17465161
申请日：2021-09-02
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung Kang , Gil Ha Lee , Shin Haeng Heo , Hyung Ho Seo , Hong Cheol Kim
CPC classification number: H01Q21/065 , H01Q1/02 , H01Q1/2283 , H01Q9/045 , H01Q21/0025 , H01Q21/0087 , H01Q1/243
Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.
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公开(公告)号：US11183765B2
公开(公告)日：2021-11-23
申请号：US16891265
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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