公开(公告)号：US20230281774A1

公开(公告)日：2023-09-07

申请号：US18104488

申请日：2023-02-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Kweon JOUNG ,  Won Kyu JANG ,  Hee Sung JUN

IPC: G06T5/50 ,  G06V10/26 ,  H04N23/55 ,  G06F3/14 ,  H04B1/40

CPC classification number: G06T5/50 ,  G06F3/14 ,  G06V10/26 ,  H04B1/40 ,  H04N23/55 ,  G06T2207/20221

Abstract: A see-through camera apparatus includes a camera unit configured to acquire a first image of a scene, an RF sensor unit configured to receive an RF received signal and obtain a second image of the scene corresponding to a blind spot-object obscured by an obstacle based on the RF received signal, and an image processor configured to generate a third image based on the first image and the second image.

公开(公告)号：US20190207323A1

公开(公告)日：2019-07-04

申请号：US16166494

申请日：2018-10-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Il Kweon JOUNG ,  Yong Hyen PARK ,  Jung Won LEE

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q1/52 ,  H01Q1/22

CPC classification number: H01Q21/065 ,  H01Q1/2283 ,  H01Q1/526 ,  H01Q9/0414

Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.

公开(公告)号：US20210320428A1

公开(公告)日：2021-10-14

申请号：US17355365

申请日：2021-06-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Il Kweon JOUNG ,  Yong Hyen PARK ,  Jung Won LEE

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q25/00 ,  H01Q1/24 ,  H01Q21/28

Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.