METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME
    1.
    发明申请
    METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME 审中-公开
    使用该方法修复探针板和探针板

    公开(公告)号:US20140318838A1

    公开(公告)日:2014-10-30

    申请号:US14330882

    申请日:2014-07-14

    IPC分类号: H05K1/11 G01R1/02

    摘要: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

    摘要翻译: 提供了一种修复探针板的方法,所述方法包括:在形成为陶瓷烧结体的板体中制备多个填充有第一填充材料的第一通孔电极; 在所述多个第一通孔电极中形成用于开放通孔电极的通孔; 用具有比第一填充材料低的烧结温度的第二填充材料填充通孔; 以及通过烧结所述第二填充材料形成第二通孔电极。 根据本发明的开放通孔修复提高了板的制造成品率并降低了其制造成本。