公开(公告)号：US20210151899A1

公开(公告)日：2021-05-20

申请号：US16822867

申请日：2020-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hyoung PARK ,  Young Sik HUR ,  Sung Yong AN ,  Myeong Woo HAN ,  Kyu Bum HAN ,  Dae Ki LIM

IPC: H01Q21/06 ,  H01Q1/22

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

公开(公告)号：US20210143527A1

公开(公告)日：2021-05-13

申请号：US17151952

申请日：2021-01-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

公开(公告)号：US20210075114A1

公开(公告)日：2021-03-11

申请号：US17101709

申请日：2020-11-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Nam Ki KIM ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Myeong Woo HAN ,  Dae Ki LIM

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q21/06 ,  H01Q21/00

Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.

公开(公告)号：US20210021039A1

公开(公告)日：2021-01-21

申请号：US17060319

申请日：2020-10-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Nam Ki KIM ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Dae Ki LIM ,  Myeong Woo HAN

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/498 ,  H01L23/66

Abstract: An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.

公开(公告)号：US20200259269A1

公开(公告)日：2020-08-13

申请号：US16725377

申请日：2019-12-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Nam CHO ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Kyu Bum HAN ,  Sung Yong AN

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q19/10

Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

公开(公告)号：US20190334241A1

公开(公告)日：2019-10-31

申请号：US16185350

申请日：2018-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myeong Woo HAN ,  Nam Ki KIM ,  Dae Ki LIM ,  Ju Hyoung PARK ,  Jeong Ki RYOO

IPC: H01Q9/04 ,  H01Q1/52

Abstract: An antenna apparatus includes: a ground layer; a feed line disposed in a position lower than a position of the ground layer; and an antenna structure including a first radiation part connected to one end of the feed line and configured to provide a first electromagnetic plane in a first direction, and a second radiation part connected to the first radiation part, configured to provide a second electromagnetic plane in a second direction, and disposed such that at least a portion of the second radiation part is disposed in a position higher than the position of the ground layer.

公开(公告)号：US20190305432A1

公开(公告)日：2019-10-03

申请号：US16260505

申请日：2019-01-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Nam Ki KIM ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Myeong Woo HAN ,  Dae Ki LIM

IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q1/38 ,  H01Q21/06

Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.

公开(公告)号：US20220102872A1

公开(公告)日：2022-03-31

申请号：US17547633

申请日：2021-12-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hyoung PARK ,  Kyu Bum HAN ,  Jae Yeong KIM ,  Jeong Ki RYOO ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

公开(公告)号：US20210066782A1

公开(公告)日：2021-03-04

申请号：US16743453

申请日：2020-01-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

公开(公告)号：US20210044021A1

公开(公告)日：2021-02-11

申请号：US17083368

申请日：2020-10-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Dae Ki LIM ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Nam Ki KIM ,  Myeong Woo HAN

IPC: H01Q9/04 ,  H01Q1/52 ,  H01Q19/30 ,  H01Q19/00

Abstract: An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.