公开(公告)号：US20230375936A1

公开(公告)日：2023-11-23

申请号：US18153568

申请日：2023-01-12

Applicant: Samsung Electronics Co, Ltd.

Inventor： Sangjin KIM ,  Chansik KIM ,  Geun Su LEE ,  Sungjae JUNG ,  Dokyeong KWON ,  Yigwon KIM ,  Hyunju SONG ,  Hyungju RYU ,  Tae Min CHOI ,  Keon HUH

IPC: G03F7/32 ,  C08F297/02

CPC classification number: G03F7/322 ,  C08F297/02

Abstract: A developing composition and a method of forming a pattern using the same are provided. According to embodiments of inventive concepts, the developing composition may include at least one repeating unit selected from a first repeating unit represented by Chemical Formula A1 a second repeating unit represented by Chemical Formula A2, or both the first repeating unit represented by Chemical Formula A1 and second repeating unit represented by Chemical Formula A2. The developing composition may further include a copolymer including a third repeating unit represented by Chemical Formula A3.

公开(公告)号：US20240255848A1

公开(公告)日：2024-08-01

申请号：US18449156

申请日：2023-08-14

Applicant: Geun Su Lee ,  Samsung Electronics Co., Ltd.

Inventor： Chawon KOH ,  Yeon Hee SEONG ,  Tsunehiro NISHI ,  Geun Su LEE ,  Sung Jae JUNG ,  Moo Hyun KOH ,  Ji Young PARK ,  Seungyeol BAEK

IPC: G03F7/004 ,  C07F7/22 ,  C07F9/6596 ,  G03F7/075 ,  G03F7/16 ,  G03F7/38 ,  H01L21/027

CPC classification number: G03F7/0045 ,  C07F7/2224 ,  C07F9/6596 ,  G03F7/0757 ,  G03F7/168 ,  G03F7/38 ,  H01L21/0274

Abstract: The present disclosure relates to a semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1 and a solvent, and a method of forming patterns by using the semiconductor photoresist composition.