FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE

    公开(公告)号:US20230422448A1

    公开(公告)日:2023-12-28

    申请号:US18039656

    申请日:2021-04-13

    IPC分类号: H05K7/20 G06F1/20 G06F1/16

    摘要: A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the first and second housings, a hinge housing accommodating the hinge assembly and disposed between the first and second housings, a flexible display disposed from one region of the first housing to a region of the second housing across the hinge assembly, and foldable depending on a rotation of the hinge assembly, a first plate disposed between the flexible display and the first housing, a second plate disposed between the flexible display and the second housing, and a first heat dissipating structure disposed between the first component and thermally coupled to one end of the hinge housing, and providing a first heat transfer path for transferring heat generated from the first component to the hinge housing.